*Material characterization:* TEM, STEM, SEM ,Electron Holography (EH),
EDS, EELS, XRD, CL, PL, Hall measuremnt
*Material processing:* Familiar with Focused Ion Beam (FIB)
system, mechanical polishing, vacuum system, RF-Sputtering system, thermal
annealing, wet etching.
*Device Design: *Device simulation and optimization
of epitaxial layer structure
*Tools:* JEM ARM 200F, JEOL 2010F,
PHILLIPS CM 200, JEOL 4000EX, NOVA 200 (FIB), XL-30 SEM
*Computer techniques:* C/C++, Mathematica, Matlab, Gatan Digital
Micrograph, CorelDraw, Origin, Microsoft office.
*Courses:* Semiconductor device physics,
Growth and Processing of Semiconductor, Material physics, Electron
microscopy I &II, Quantum Physics